优点:电子陶瓷绝缘材料不导电,即电阻率高,绝缘强度高。对于一种  的绝缘陶瓷的性能要求,主要是在电磁性能和机械性能两方面:体积电阻率高,相对介电系数小,电磁性能损耗因子小,介电强度高;具有良好的导热性、耐腐蚀、不变形,可以在很大的温度范围内使用;机械加工性能膨胀系数接近半导体材料。Advantage:TM'sElectronicceramicinsulationisnotconductive,,mainlyinthemagneticpropertiesandmechanicalpropertiesoftwoaspects:highvolumeresistivity,therelativedielectriccoefficientissmall,theelectromagneticperformancedissipationfactorissmall,,corrosionresistance,nodeformation,itcanbeusedinawiderangeoftemperatures;Mechanicalprocessingperformanceexpansioncoefficientisclosetothesemiconductormaterial.应用:电子陶瓷材料在电子设备中用作安装、固定、支撑、保护、绝缘、隔离及连接各种无线电元件及器件,称为绝缘陶瓷或装置陶瓷。例如电路基板,芯片封装外壳等,电子陶瓷材料属于精细化工和电子材料的交叉领域。Application:TM'sElectronicceramicmaterialsusedintheelectronicequipment,asfixedinstallation,support,protection,insulation,isolationandconnectallkindsofradiocomponentsanddevices,,Substrate,chipencapsulationshell,electronicceramicmaterialbelongstothecrossfieldoffinechemicalsandelectronicmaterials.功能:耐高温高湿\绝缘\隔热\耐腐蚀\耐磨Function:hightemperatureandhumidityresistance\insulation\thermalinsulation\anti-corrosion\wearresistant颜色:乳白色Colour:ivory成型工艺:热压/干压/等静压/挤压Formingprocess:hot-pressing/drypressing/isostaticpressing/extrusionForming理化指标:PhysicalandChemicalIndex:特性PropertyElectricandelectronicceramic氧化铝AL2O3(%)94-99.7体积密度bulkdensity(g/cm3)≥3.55-3.95莫氏硬度Moh’shardness9热膨胀系数coefficientofthermalexpansion(m/m.K)(20-1000℃)7-8×10-6导热系数Thermalconductivity(w/m.k)18-22绝缘强度Insulatingstrength（KV/mm）15-20直流击穿强度DCbreakdownstrength(Kv/mm)17.6-20吸水率Waterabsorption（%）<0.08断裂韧性fracturetoughnessKΙC≥4.8MPa·m1/2抗弯强度flexurestrength≥290MPa常温耐压强度Ambientcompressivestrength（Mpa）≥850常温抗折强度Coldbendingstrength(Mpa)≥520耐火度Refractoriness（℃）≥2000最高使用温度Maxservicetemperature(℃)≥1650