产品特征
 
分散性好 收缩率小  
 
结晶度高 导电性好 填充性好 
 
 Feature 
 
 Good dispersion, Low shrinkage, High degree of crystallinity, Good dispersion , Good conductivity, Good fillibility 
 
 
 
产品应用
 
用于制备厚膜导体浆料，如多层元件和线路板(如LTCC)的内外电极，PDP、HIC、太阳能电池等银导体浆料。
 
Application:
 
Apply to manufacturing the thick-film conductive pastes, such as the pastes for the internal and external electrodes of multi-layered component and circuit board (LTCC), PDP, HIC and solar cell.
 
 
 
产品规格
 
 
 
 
  
 
   
 
規格 
 
 
   
 
平均粒径(μm) 
 
 
   
 
比表面積 
 
(m2/g) 
 
 
   
 
粒度分布(μm)
 
 
   
 
タップ密度(g/cm3) 
 
 
  
 
  
 
   
 
D10 
 
 
   
 
D50 
 
 
   
 
D90 
 
 
  
 
  
 
   
 
Ag-S0250 
 
 
   
 
- 
 
 
   
 
- 
 
 
   
 
- 
 
 
   
 
- 
 
 
   
 
- 
 
 
   
 
- 
 
 
  
 
  
 
   
 
Ag-S0300 
 
 
   
 
- 
 
 
   
 
- 
 
 
   
 
- 
 
 
   
 
- 
 
 
   
 
- 
 
 
   
 
- 
 
 
  
 
  
 
   
 
Ag-S0400 
 
 
   
 
0.38-0.45 
 
 
   
 
1.27-1.50 
 
 
   
 
0.17-0.25 
 
 
   
 
0.45-0.58 
 
 
   
 
0.85-1.02 
 
 
   
 
≥4.2 
 
 
  
 
  
 
   
 
Ag-S0800 
 
 
   
 
0.82-0.95 
 
 
   
 
0.60-0.70 
 
 
   
 
0.55-0.80 
 
 
   
 
0.90-1.30 
 
 
   
 
1.40-2.80 
 
 
   
 
≥4.6 
 
 
  
 
  
 
   
 
Ag-F0800 
 
(flake powder) 
 
 
   
 
- 
 
 
   
 
1.10-1.40 
 
 
   
 
0.48-0.68 
 
 
   
 
0.95-1.25 
 
 
   
 
2.20-2.60 
 
 
   
 
≥4.3 
 
 
  
 
  
 
   
 
Ag-S2000 
 
 
   
 
1.80-2.20 
 
 
   
 
0.25-0.32 
 
 
   
 
1.00-1.40 
 
 
   
 
2.00-2.65 
 
 
   
 
3.80-5.20 
 
 
   
 
≥5.0 
 
 
  
 
  
 
   
 
Ag-F2000
 
(flake powder) 
 
 
   
 
- 
 
 
   
 
0.62-0.85 
 
 
   
 
1.80-2.30 
 
 
   
 
3.20-3.70 
 
 
   
 
5.20-5.70 
 
 
   
 
≥4.0 
 
 
  
 
  
 
   
 
Ag-S4000 
 
 
   
 
- 
 
 
   
 
- 
 
 
   
 
- 
 
 
   
 
- 
 
 
   
 
- 
 
 
   
 
- 
 
 
  
 
 
 
 
Different specifications of products can be customized.
 
* T     tter ‘F’ in the specification means flake powder.