基本介绍
LOCTITE ABLESTIK 84-3J 粘合剂专为芯片粘接应用和部件粘接应用而设计。应用以及部件粘接。使用这种材料作为芯片元件下的 作为芯片元件下的固定化合物,有助于消除由于导电粘合剂的毛细作用而造成的短路现象。导电粘合剂的毛细作用而造成的短路。
性能特点
技术参数
使用说明
DIRECTIONS FOR USE
equipment for use.
, care
must be exercised to avoid entrapment of contaminants and/or
air into the adhesive.
's
recommended work life.
25 to 50 μm wet bondline
thickness, dispensed with approximately 25 to 50 % filleting on all
sides of the die.
application requirements.
bondline voids than the matrix style of dispense pattern.
采购须知